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Welcome to IEEE-EPIC 2026

 The 2026 IEEE 1st International Conference on Advanced Sensing for Embodied Perception and Physical AI (IEEE-EPIC 2026) will be held in Shenzhen, China, from December 4 to 7, 2026.

Embodied sensing

About the Conference

1. The IEEE International Conference on Advanced Sensing for Embodied Perception and Physical Artificial Intelligence is an annual exclusive academic forum focusing on fundamental research of physical artificial intelligence sensing.
2. Embodied intelligence requires robust and reliable perception and closed-loop interaction in the real world, with application scenarios covering autonomous robots, intelligent manufacturing systems, wearable and implantable devices, assistive and rehabilitation technologies, and clinical medical devices.
3. Every year, scholars from around the world gather to present the latest research results in areas such as sensors and devices, multimodal sensing and fusion, edge artificial intelligence, perception-action learning, calibration and reliability, as well as rigorous validation in laboratory, field and clinical environments.
4. Meanwhile, cutting-edge enterprises will share technological progress behind benchmark products, prototypes and large-scale practical applications, focusing on design trade-offs, safety compliance, and practical experience gained from real users and patients.
5. Through plenary talks, special tutorials, academic competitions and technical demonstrations, the conference builds a bridge between academia, industry and medical circles, accelerates technology transfer and transformation, facilitates multi-party cooperation, and leads the development direction of embodied intelligence in the next decade.

Call for Papers

We sincerely invite submissions of manuscripts reporting the latest scientific and technological research results in the following areas (including but not limited to):

Sensor Hardware & Advanced Manufacturing

  • Novel Sensing Modalities and Transducers (Micro/Nano Sensing, Flexible Sensing, Photonic Sensing, Biochemical Sensing)
  • Sensor Materials, Fabrication and Packaging Technologies (MEMS/NEMS, Nanomanufacturing, Integration Technologies)
  • Wearable Sensors, Implantable Sensors and Epidermal Electronic Sensors
  • Energy Harvesting, Power Management and Self-Powered Sensing Technologies

Embedded Circuits & Edge Intelligent Systems

  • Edge Sensing Systems and Embedded/Low-Power Technologies
  • Artificial Intelligence Sensor Interfaces, Readout Circuits and Analog-Digital Hybrid Systems (Tiny Machine Learning, Neuromorphic Computing)
  • LiDAR, Millimeter Wave Radar, Ultrasonic and Acoustic Sensing
  • Digital Twin and Simulation Technologies for Sensing System Design and Validation

Human-Robot Interaction & Biomedical Applications

  • Robotic Tactile, Force/Torque and Proprioceptive Sensing Technologies
  • Multimodal Sensing and Sensor Fusion
  • Embodied Intelligent Perception Technologies (State Estimation, Simultaneous Localization and Mapping, Target Tracking)
  • Perception-Action Learning and Closed-Loop Control

Robotic Perception & Closed-Loop Control

  • Robot Demonstration Learning and Human-Robot Collaborative Perception
  • Human-Robot Interaction and Intent Recognition (Multisensor Fusion Human-Robot Interaction (HRI))
  • Healthcare and Assistive Applications (Rehabilitation Medicine, Elderly Care, Health Monitoring, Medical Service Robots)
  • Privacy Protection, Security and Trustworthy Sensing Technologies for Sensing Systems (Edge Processing, Federated Learning)

Important Dates

Paper Submission Guideline

Prospective authors are requested to submit full length paper in English for proceedings publication. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements and can be retrieved by EI Compendex and Scopus.

Submission is OPEN now!

Venue

Jen Shenzhen Qianhai By Shangri-La
No. 399 Qianwan 1st Road
Nanshan District
Shenzhen, China